810-015932-001 LAM Circuit Board Module

810-015932-001 LAM Circuit Board Module

810-015987-101 LAM Circuit Board modules are key components in LAM Research semiconductor wafer manufacturing equipment. It acts as a key interface between the system control circuit and various sensors and actuators, enabling the precise and efficient operation of the device during the wafer processing step.

Main features:

TCP Autotuning function: The 810-015987-101 module is designed for TCP (Tool Condition Parameters) autotuning function. TCP autotuning is a process of dynamically adjusting system parameters based on real-time feedback from sensors, ensuring optimal performance and tool health.

Sensor and actuator interface: This module provides an interface for connecting various sensors and actuators, allowing the control system to collect data and send control signals to maintain precise control over the wafer processing steps.

Data acquisition and processing: The module is able to take data from sensors and process it using an embedded microcontroller or a dedicated processor. The control system then uses this processed data to make informed decisions and adjustments.

Communication interface: The module may include a communication interface, such as RS-232 or Ethernet, to communicate with higher level control systems and monitoring software.

810-015932-001

Applications:

810-015987-101 LAM Board modules are primarily used in LAM Research semiconductor wafer fabrication equipment, particularly in applications involving:

Etching system: Controls the etching process, removing material from the wafer to create the desired pattern.

Deposition system: Controlling the deposition process, material will be added to the wafer to form a thin film.

Metering system: Measurement of measured thickness, uniformity, and other characteristics of the film on the wafer. And other features.

Cleaning system: Maintains wafer cleanliness by removing contaminants and particles.

810-015932-001 LAM Circuit Board Module